Size: 290 * 85 MM

Layer: 10L

Stacking: 1+8+1 1-medium blind buried hole process

Plate thickness: 1.0mm

Single board PIN count: 10000+

Maximum single line frequency: 6G HZ

Maximum differential signal: 16G HZ

Minimum line width: 3MIL

Minimum line spacing: 3MIL

Minimum aperture: 5MIL (laser perforation)

Completion time: 15 working days

Difficulty level: ☆☆☆☆☆

Difficulty: The PCB board has a heterogeneous structure, limited wiring space, and high power supply current.

Design highlight: The Intel CPU original specification sheet has 14 layers of blind hole embedding technology, and we have completed the design with 1 layer of blind hole embedding and 10 layers, and the prototype has been verified through various tests. Save a lot of costs for customers.