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0731 8501 5902
E-mail
wehh@lindeng.net
Business Scope

Business Scope

Design capability
Maximum design layers: 64 layersMaximum Number of PIN: 1000+
Maximum Connections: 1000+Minimum Hole: 8MIL(mechanical perforation); 4MIL(laser perforation)
Minimum Line Width: 50 μm(2 mil)Minimum Line Spacing : 2.4MIL
Maximum BGA Number on one PCB: infiniteMinimum BGA PIN Spacing: 0.3mm
Highest Speed Signal: 40G differential signalMaximum BGA PIN Number: 4096
Highest Frequency of the Chip: 5.4G